Invention Grant
- Patent Title: Microscale optoelectronic device packages
- Patent Title (中): 微尺度光电器件封装
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Application No.: US11753483Application Date: 2007-05-24
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Publication No.: US08436371B2Publication Date: 2013-05-07
- Inventor: Nicholas W. Medendorp, Jr. , James Ibbetson
- Applicant: Nicholas W. Medendorp, Jr. , James Ibbetson
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Agent Vincent K. Gustafson
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
An optoelectronic device article comprises a substrate containing at least one electrically conductive microvia, at least one emitter diode and at least one ESD diode, optionally formed in situ, disposed in or on the substrate, and an electrically conductive path between the foregoing elements. A reflector cavity may be defined in the substrate for receiving the emitter diode(s), with retention elements on the substrate used to retain a lens material. High flux density and high emitter diode spatial density may be attained. Thermal sensors, radiation sensors, and integral heat spreaders comprising one or more protruding fins may be integrated into the article.
Public/Granted literature
- US20080290353A1 MICROSCALE OPTOELECTRONIC DEVICE PACKAGES Public/Granted day:2008-11-27
Information query
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