Invention Grant
- Patent Title: Light emitting diode component
- Patent Title (中): 发光二极管组件
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Application No.: US12884717Application Date: 2010-09-17
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Publication No.: US08436380B2Publication Date: 2013-05-07
- Inventor: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
- Applicant: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
- Applicant Address: US OH Cleveland
- Assignee: GE Lighting Solutions, LLC
- Current Assignee: GE Lighting Solutions, LLC
- Current Assignee Address: US OH Cleveland
- Agency: Fay Sharpe LLP
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L29/227 ; H01L27/15 ; H01L29/267 ; H01L29/24
Abstract:
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
Public/Granted literature
- US20110018014A1 LIGHT EMITTING DIODE COMPONENT Public/Granted day:2011-01-27
Information query
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