Invention Grant
- Patent Title: Leadframe package for light emitting diode device
- Patent Title (中): 用于发光二极管器件的引线框封装
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Application No.: US12768755Application Date: 2010-04-28
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Publication No.: US08436391B2Publication Date: 2013-05-07
- Inventor: Nguyen The Tran , Yongzhi He , Frank Shi
- Applicant: Nguyen The Tran , Yongzhi He , Frank Shi
- Applicant Address: KR Chungcheongbuk-do
- Assignee: Nepes Led Corporation
- Current Assignee: Nepes Led Corporation
- Current Assignee Address: KR Chungcheongbuk-do
- Agency: Ladas & Parry LLP
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
Public/Granted literature
- US20100230791A1 LEADFRAME PACKAGE FOR LIGHT EMITTING DIODE DEVICE Public/Granted day:2010-09-16
Information query
IPC分类: