Invention Grant
- Patent Title: Light emitting diode package and manufacturing method thereof
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US13031582Application Date: 2011-02-21
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Publication No.: US08436392B2Publication Date: 2013-05-07
- Inventor: Chao-Hsiung Chang , Chieh-Ling Chang , Shen-Bo Lin
- Applicant: Chao-Hsiung Chang , Chieh-Ling Chang , Shen-Bo Lin
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis Law Group, Inc.
- Priority: CN201010254496 20100816
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/08
Abstract:
A light emitting diode package comprises a substrate with a first surface and a second surface opposite to each other, a circuit on the substrate, a support on the substrate for reinforcing strength of the substrate, a plurality of light emitting diodes on the substrate and electrically connected to the circuit, and a cover layer on the plurality of light emitting diodes. A method for manufacturing a light-emitting diode package is further provided.
Public/Granted literature
- US20120037947A1 LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-02-16
Information query
IPC分类:
