Invention Grant
- Patent Title: Semiconductor light emitting element, method for manufacturing semiconductor light emitting element, and lamp
- Patent Title (中): 半导体发光元件,半导体发光元件的制造方法以及灯
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Application No.: US12993733Application Date: 2009-05-20
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Publication No.: US08436396B2Publication Date: 2013-05-07
- Inventor: Hironao Shinohara , Naoki Fukunaga
- Applicant: Hironao Shinohara , Naoki Fukunaga
- Applicant Address: JP Aichi
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-131882 20080520
- International Application: PCT/JP2009/059286 WO 20090520
- International Announcement: WO2009/142246 WO 20091126
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L29/00

Abstract:
A semiconductor light-emitting device (1) of the present invention includes a substrate (101); a laminate semiconductor layer (20) formed by sequentially laminating an n-type semiconductor layer (104), a light-emitting layer (105), and a p-type semiconductor layer (106) on the substrate (101); and a translucent electrode layer (109) formed on a top surface (106a) of the p-type semiconductor layer (106), wherein the translucent electrode layer (109) contains a dopant element, a content of the dopant element within the translucent electrode layer (109) decreases gradually toward the interface (109a) between the p-type semiconductor layer (106) and the translucent electrode layer (109), and in the translucent electrode layer (109) is formed a diffusion region in which an element constituting the p-type semiconductor layer (106) is diffused from the interface (109a) toward the inside of the translucent electrode layer (109).
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