Invention Grant
- Patent Title: Unattached contained semiconductor devices
- Patent Title (中): Unattached包含半导体器件
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Application No.: US13272613Application Date: 2011-10-13
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Publication No.: US08436433B1Publication Date: 2013-05-07
- Inventor: Scott D. Isebrand , Nghia T. Dinh , Andrew S. Paule , Ben P. Fok
- Applicant: Scott D. Isebrand , Nghia T. Dinh , Andrew S. Paule , Ben P. Fok
- Applicant Address: US MI Burnsville
- Assignee: Rosemount Aerospace Inc.
- Current Assignee: Rosemount Aerospace Inc.
- Current Assignee Address: US MI Burnsville
- Agency: Edwards Wildman Palmer LLP
- Agent Scott D. Wofsy; Joshua L. Jones
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L23/02 ; H04R21/02 ; H04R25/00
Abstract:
An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.
Public/Granted literature
- US20130093030A1 UNATTACHED CONTAINED SEMICONDUCTOR DEVICES Public/Granted day:2013-04-18
Information query
IPC分类:
