Invention Grant
- Patent Title: Micromechanical component
- Patent Title (中): 微机械部件
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Application No.: US13298753Application Date: 2011-11-17
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Publication No.: US08436434B2Publication Date: 2013-05-07
- Inventor: Jochen Reinmuth
- Applicant: Jochen Reinmuth
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102010062056 20101126
- Main IPC: H01L29/84
- IPC: H01L29/84 ; G01P15/125

Abstract:
A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.
Public/Granted literature
- US20120133003A1 MICROMECHANICAL COMPONENT Public/Granted day:2012-05-31
Information query
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