Invention Grant
- Patent Title: Micromechanical device lubrication
- Patent Title (中): 微机械装置润滑
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Application No.: US11617459Application Date: 2006-12-28
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Publication No.: US08436453B2Publication Date: 2013-05-07
- Inventor: Simon Joshua Jacobs , Seth A. Miller
- Applicant: Simon Joshua Jacobs , Seth A. Miller
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/20
- IPC: H01L23/20

Abstract:
The present application is directed to a reservoir for use with a micro-electromechanical device having a first surface area to be lubricant. The reservoir comprises a solid component with a porous structure having a second surface area. The second surface area is greater than the first surface area. The reservoir also comprises a lubricant capable of reversibly reacting with either the solid component or the first surface area of the micro-electromechanical device.
Public/Granted literature
- US20080160268A1 DEVICE PACKAGE AND METHOD OF MAKING A DEVICE PACKAGE Public/Granted day:2008-07-03
Information query
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