A microelectronic assembly can include a substrate having oppositely-facing first and second surfaces and a first aperture extending between the first and second surfaces, a first microelectronic element having a surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, signal leads connected to contacts of the second microelectronic element and extending through the first aperture to at least some of a plurality of electrically conductive elements on the substrate, and at least one power regulation component having active circuit elements therein disposed between the first surface of the substrate and the front surface of the second microelectronic element. The first microelectronic element can have another surface remote from the surface of the first microelectronic element, and an edge extending between the surfaces thereof. The contacts of the second microelectronic element can project beyond the edge of the first microelectronic element.