Invention Grant
- Patent Title: Packaging substrate structure with electronic component embedded therein and method for manufacture of the same
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Application No.: US12230345Application Date: 2008-08-28
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Publication No.: US08436463B2Publication Date: 2013-05-07
- Inventor: Shih-Ping Hsu
- Applicant: Shih-Ping Hsu
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Bacon & Thomas PLLC
- Priority: TW96131901A 20070828
- Main IPC: H01L23/12
- IPC: H01L23/12

Abstract:
A packaging substrate structure with an electronic component embedded therein and a fabricating method thereof are disclosed. The packaging substrate structure comprises a core plate; a first built-up structure disposed on a surface of the core plate and comprising a first dielectric layer and a first circuit layer disposed on the first dielectric layer; a second built-up structure disposed on the first built-up structure, wherein a cavity is disposed in the second built-up structure to expose the first built-up structure; an electronic component disposed in the cavity, wherein the electronic component has an active surface having a plurality of electrode pads and an inactive surface facing the first built-up structure; and a solder mask disposed on the surfaces of the second built-up structure and the electronic component, and having a plurality of first openings to expose the electrode pads of the electronic component.
Public/Granted literature
Information query
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