Invention Grant
US08436500B2 Semiconductor module and motorized equipment using the same 有权
半导体模块和电动设备使用相同

Semiconductor module and motorized equipment using the same
Abstract:
In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.
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