Invention Grant
- Patent Title: Semiconductor module and motorized equipment using the same
- Patent Title (中): 半导体模块和电动设备使用相同
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Application No.: US13087658Application Date: 2011-04-15
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Publication No.: US08436500B2Publication Date: 2013-05-07
- Inventor: Hideki Minato
- Applicant: Hideki Minato
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2010-94786 20100416
- Main IPC: H02K11/00
- IPC: H02K11/00

Abstract:
In a power module having two systems of inverter circuits for driving an electric motor of a motorized equipment, a wiring board mounted with power transistors and shunt resistances is embedded in a plate-like mold section. A plurality of lands have radiation surfaces exposed from the mold section. The radiation surfaces of a first land row constituted by a first group of the lands are provided on the same plane and the same straight line, and the radiation surfaces of a second land row constituted by a second group of the lands are provided on the same plane and the same straight line. The radiation surfaces of the first and second land rows are in surface-to-surface contact with a heat sink through insulation radiation sheets to dissipate a heat generated by the power module.
Public/Granted literature
- US20110254411A1 SEMICONDUCTOR MODULE AND MOTORIZED EQUIPMENT USING THE SAME Public/Granted day:2011-10-20
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