Invention Grant
US08436516B2 Resonator device including electrode with buried temperature compensating layer
有权
谐振器器件包括具有埋入温度补偿层的电极
- Patent Title: Resonator device including electrode with buried temperature compensating layer
- Patent Title (中): 谐振器器件包括具有埋入温度补偿层的电极
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Application No.: US13404095Application Date: 2012-02-24
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Publication No.: US08436516B2Publication Date: 2013-05-07
- Inventor: Richard C. Ruby , Wei Pang , Qiang Zou , Donald Lee
- Applicant: Richard C. Ruby , Wei Pang , Qiang Zou , Donald Lee
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.
Public/Granted literature
- US20120154074A1 RESONATOR DEVICE INCLUDING ELECTRODE WITH BURIED TEMPERATURE COMPENSATING LAYER Public/Granted day:2012-06-21
Information query
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