Invention Grant
- Patent Title: Wafer stage
- Patent Title (中): 晶圆舞台
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Application No.: US12483432Application Date: 2009-06-12
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Publication No.: US08436631B2Publication Date: 2013-05-07
- Inventor: Choon Meng Chua , Lian Ser Koh , Wah Pheng Chua , Chee Hong Jacob Phang , Soon Huat Tan
- Applicant: Choon Meng Chua , Lian Ser Koh , Wah Pheng Chua , Chee Hong Jacob Phang , Soon Huat Tan
- Applicant Address: SG Singapore
- Assignee: Semicaps Pte Ltd
- Current Assignee: Semicaps Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Volpe and Koenig, P.C.
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe.
Public/Granted literature
- US20100315617A1 WAFER STAGE Public/Granted day:2010-12-16
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