Invention Grant
US08436879B2 Thermal head mechanism, printing device using the same, and method of supporting thermal head
有权
热敏头机构，使用相同的印刷装置，以及支撑热敏头的方法
- Patent Title: Thermal head mechanism, printing device using the same, and method of supporting thermal head
- Patent Title (中): 热敏头机构，使用相同的印刷装置，以及支撑热敏头的方法
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Application No.: US12868464Application Date: 2010-08-25
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Publication No.: US08436879B2Publication Date: 2013-05-07
- Inventor: Katsutoshi Sato
- Applicant: Katsutoshi Sato
- Applicant Address: JP Tokyo
- Assignee: Toshiba Tec Kabushiki Kaisha
- Current Assignee: Toshiba Tec Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2009-214874 20090916
- Main IPC: B41J25/304
- IPC: B41J25/304
Abstract:
A printhead mechanism and printing device capable of readily achieving adequate printing pressure are provided. The printhead mechanism includes a thermal printhead supported and pressed to a paper sheet or ink ribbon moving in a predetermined conveyance direction, a pressing mechanism pressing the thermal printhead in a direction orthogonal to the conveyance direction, a head supporting mechanism supporting the thermal printhead movably in head-pressing direction, wherein an acting point P2 of a pressing-force W, at which the thermal printhead is pressed, is disposed downstream of a supporting point p3 at which the thermal printhead is supported.
Public/Granted literature
- US20110063395A1 THERMAL HEAD MECHANISM, PRINTING DEVICE USING THE SAME, AND METHOD OF SUPPORTING THERMAL HEAD Public/Granted day:2011-03-17
Information query
IPC分类:
