Invention Grant
US08436977B2 Lithographic method to apply a pattern to a substrate and lithographic apparatus
有权
将图案应用于基板和光刻设备的平版印刷方法
- Patent Title: Lithographic method to apply a pattern to a substrate and lithographic apparatus
- Patent Title (中): 将图案应用于基板和光刻设备的平版印刷方法
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Application No.: US12390552Application Date: 2009-02-23
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Publication No.: US08436977B2Publication Date: 2013-05-07
- Inventor: Haico Victor Kok
- Applicant: Haico Victor Kok
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G03B27/68
- IPC: G03B27/68 ; G03B27/52
Abstract:
A slit shaped area of a patterning device is illuminated to impart a radiation beam with a pattern in its cross-section. A projection system projects the patterned radiation beam onto a target portion of a substrate. As the radiation beam is scanned across the target portion of the substrate, a configuration of the projection system is adjusted and applies a pattern to the target portion. The adjusting may affect a magnitude of an image magnification component of the projection system, along the length of the slit shaped area, or an image distortion in a scan direction. The adjusting is arranged to compensate an effect on pattern overlay accuracy of a distortion of the patterning device.
Public/Granted literature
- US20090213351A1 Lithographic Method to Apply a Pattern to a Substrate and Lithographic Apparatus Public/Granted day:2009-08-27
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