Invention Grant
- Patent Title: Multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子元件
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Application No.: US13478900Application Date: 2012-05-23
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Publication No.: US08437115B2Publication Date: 2013-05-07
- Inventor: Sang Huk Kim , Jang Ho Lee , Ju Myung Suh , Sung Hyuk Choi , Jong Hoon Bae , Jun Hee Kim , Seon Ki Song
- Applicant: Sang Huk Kim , Jang Ho Lee , Ju Myung Suh , Sung Hyuk Choi , Jong Hoon Bae , Jun Hee Kim , Seon Ki Song
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0075084 20110728
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/008

Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer having an average thickness of 0.6 μm or less; and first and second inner electrode layers within the ceramic body, disposed to face each other with the dielectric layer interposed therebetween, wherein the dielectric layer includes contact dielectric grains in contact with the first or second inner electrode layer and non-contact dielectric grains not in contact with the first or second inner electrode layer, and, when an average thickness of the dielectric layer is defined as td and an average diameter of the contact dielectric grains is defined as De, De/td≦0.35 is satisfied. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability.
Public/Granted literature
- US20130027842A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2013-01-31
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