Invention Grant
- Patent Title: Electronic device housing and manufacturing method thereof
- Patent Title (中): 电子设备外壳及其制造方法
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Application No.: US12965853Application Date: 2010-12-11
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Publication No.: US08437131B2Publication Date: 2013-05-07
- Inventor: Bin Dai , Fa-Guang Shi
- Applicant: Bin Dai , Fa-Guang Shi
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010248394 20100809
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H04M1/00
Abstract:
An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing. The support frame defines a positioning groove in an edge. The plastic side frame is partially embedded in the positioning groove of the support frame. A method of manufacturing an electronic device housing is also provided.
Public/Granted literature
- US20120033356A1 ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-02-09
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