Invention Grant
US08437137B2 Fixing mechanism for fixing a thermal module on a base and related electronic device
有权
用于将热模块固定在基座和相关电子设备上的固定机构
- Patent Title: Fixing mechanism for fixing a thermal module on a base and related electronic device
- Patent Title (中): 用于将热模块固定在基座和相关电子设备上的固定机构
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Application No.: US12910842Application Date: 2010-10-24
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Publication No.: US08437137B2Publication Date: 2013-05-07
- Inventor: Lin-Yu Lee , Shang-Chih Yang
- Applicant: Lin-Yu Lee , Shang-Chih Yang
- Applicant Address: TW Baoan District, Shenzhen, Guangdong Province
- Assignee: MSI Computer (Shenzhen) Co., Ltd.
- Current Assignee: MSI Computer (Shenzhen) Co., Ltd.
- Current Assignee Address: TW Baoan District, Shenzhen, Guangdong Province
- Agent Winston Hsu; Scott Margo
- Priority: TW99216110U 20100820
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component.
Public/Granted literature
- US20120044648A1 FIXING MECHANISM FOR FIXING A THERMAL MODULE ON A BASE AND RELATED ELECTRONIC DEVICE Public/Granted day:2012-02-23
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