Invention Grant
- Patent Title: Laminate mount assembly
- Patent Title (中): 层压安装总成
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Application No.: US12942236Application Date: 2010-11-09
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Publication No.: US08437144B2Publication Date: 2013-05-07
- Inventor: Takanori Sekido
- Applicant: Takanori Sekido
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2009-259165 20091112
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface; a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member; and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.
Public/Granted literature
- US20110226510A1 LAMINATE MOUNT ASSEMBLY Public/Granted day:2011-09-22
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