Invention Grant
- Patent Title: High frequency modulator
- Patent Title (中): 高频调制器
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Application No.: US12633072Application Date: 2009-12-08
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Publication No.: US08437232B2Publication Date: 2013-05-07
- Inventor: Akihiko Doi , Shengyuan Li , Indumini Ranmuthu
- Applicant: Akihiko Doi , Shengyuan Li , Indumini Ranmuthu
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Alan A. R. Cooper; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G11B7/00
- IPC: G11B7/00

Abstract:
A high frequency modulator is described. It comprises: a first converter for receiving a constant current signal and transmitting a first converted signal; an adder coupled the first converter and operative for transmitting a summed signal in response to receiving the first converted signal and selectively receiving a triangular signal; a first oscillator coupled to the adder for receiving the summed signal, the first oscillator operative for transmitting a time varying current signal; a second converter coupled to the first oscillator for receiving the time varying current signal and operative for transmitting a second converted signal; and an output device selectively coupled to the second converter and operative for transmitting an output signal in response to receiving either the second converted signal or an offset signal.
Public/Granted literature
- US20100315937A1 HIGH FREQUENCY MODULATOR Public/Granted day:2010-12-16
Information query
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