Invention Grant
- Patent Title: Processing module with millimeter wave transceiver interconnection
- Patent Title (中): 具有毫米波收发器互连的处理模块
-
Application No.: US12202256Application Date: 2008-08-30
-
Publication No.: US08438322B2Publication Date: 2013-05-07
- Inventor: Ahmadreza (Reza) Rofougaran , Timothy W. Markison
- Applicant: Ahmadreza (Reza) Rofougaran , Timothy W. Markison
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick & Markison
- Agent Bruce E. Garlick; Jessica W. Smith
- Main IPC: G06F9/00
- IPC: G06F9/00

Abstract:
A processing module includes a fetch and decode module, an instruction register, a data register, an execution module, and a millimeter wave (MMW) transceiver section. The fetch and decode module is operable to fetch and decode an instruction of a program and to identify data associated with the instruction. The execution module is operable to execute the instruction upon the data associated with the instruction. The MMW transceiver section is operable to wirelessly receive at least one of the instruction and the data associated with the instruction from memory.
Public/Granted literature
- US20080320281A1 PROCESSING MODULE WITH MMW TRANSCEIVER INTERCONNECTION Public/Granted day:2008-12-25
Information query