Invention Grant
- Patent Title: Integrated circuit manufacturing method and semiconductor integrated circuit
- Patent Title (中): 集成电路制造方法和半导体集成电路
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Application No.: US13383335Application Date: 2011-05-27
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Publication No.: US08438523B2Publication Date: 2013-05-07
- Inventor: Daisuke Iwahashi , Masayoshi Tojima , Tokuzo Kiyohara
- Applicant: Daisuke Iwahashi , Masayoshi Tojima , Tokuzo Kiyohara
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-125275 20100531; JP2011-119206 20110527
- International Application: PCT/JP2011/002985 WO 20110527
- International Announcement: WO2011/152013 WO 20111208
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In layout design step of the semiconductor integrated circuit manufacturing method, when it is found that the wiring length between an external terminal and an IO block (external terminal I/F circuit) corresponding to the external terminal increases after a floorplan of a circuit including a functional block and the IO block is determined, placement of the IO block is determined such that the IO block is placed close to the external terminal to alleviate constraints on the wiring between the IO block and the external terminal, and timing adjustment circuits whose number is determined according to the wiring length of a bus (or a shared bus) connecting a data transfer circuit and the IO block is inserted into the bus.
Public/Granted literature
- US20120110535A1 INTEGRATED CIRCUIT MANUFACTURING METHOD AND SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2012-05-03
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