Invention Grant
- Patent Title: Electronic device having heat dissipation airflow path
- Patent Title (中): 具有散热气流路径的电子设备
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Application No.: US13095896Application Date: 2011-04-28
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Publication No.: US08438583B2Publication Date: 2013-05-07
- Inventor: Hong Li , Xiao-Hui Zhou
- Applicant: Hong Li , Xiao-Hui Zhou
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010616831 20101231
- Main IPC: G11B33/14
- IPC: G11B33/14 ; H05K7/20

Abstract:
An exemplary electronic device includes a cover, a circuit board and a driving module both mounted on the bottom cover, an electronic component fixed on the circuit board, a heat dissipating plate mounted on the circuit board and thermally contacting the electronic component, and a top cover covering the bottom cover. The driving module has a rotating shaft adapted for supportively driving an optical disk to rotate. The electronic component generates heat during operation. Through holes are defined in the top cover and located at a periphery of the rotating shaft. Two opposing elongated extending portions extend downwardly from the heat dissipating plate towards the circuit board. An airflow channel is formed between the two extending portions under the heat dissipating plate and aligned with the electronic component.
Public/Granted literature
- US20120174136A1 ELECTRONIC DEVICE HAVING HEAT DISSIPATION AIRFLOW PATH Public/Granted day:2012-07-05
Information query
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