Invention Grant
- Patent Title: Substrate processing system
- Patent Title (中): 基板加工系统
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Application No.: US12224808Application Date: 2007-03-08
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Publication No.: US08438655B2Publication Date: 2013-05-07
- Inventor: Hiroyuki Iwakura
- Applicant: Hiroyuki Iwakura
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-064037 20060309
- International Application: PCT/JP2007/054544 WO 20070308
- International Announcement: WO2007/102582 WO 20070913
- Main IPC: H04L29/06
- IPC: H04L29/06

Abstract:
A substrate processing system capable of making it easy to set an operation authority in a plurality of substrate processing apparatuses and a management device is provided. In a substrate processing system including a plurality of substrate processing apparatuses for executing a process on a wafer, a management device connected to the plurality of substrate processing apparatuses via a communication line, the management device has a display screen for setting an operation authority to each of the management device and the plurality of substrate processing apparatuses capable of communicating with the management device for each user.
Public/Granted literature
- US20090292374A1 Substrate Processing System Public/Granted day:2009-11-26
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