The stress due to contact between a probe and a measurement sample is improved when using a microcontact prober having a conductive nanotube, nanowire, or nanopillar probe, the insulating layer at the contact interface is removed, thereby the contact resistance is reduced, and the performance of semiconductor device examination is improved. The microcontact prober comprises a cantilever probe in which each cantilever is provided with a nanowire, nanopillar, or a metal-coated carbon nanotube probe projecting by 50 to 100 nm from a holder provided at the fore end and a vibrating mechanism for vibrating the cantilever horizontally with respect to the subject. The fore end of the holder may project from the free end of the cantilever, and the fore end of the holder can be checked from above the cantilever.