Invention Grant
- Patent Title: Sensor housing
- Patent Title (中): 传感器外壳
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Application No.: US12764137Application Date: 2010-04-21
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Publication No.: US08439425B2Publication Date: 2013-05-14
- Inventor: Steven Ray Thiele , Jeremy Brandon Josefovsky
- Applicant: Steven Ray Thiele , Jeremy Brandon Josefovsky
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Emerson Thomson Bennett
- Agent Clifford Vaterlaus
- Main IPC: B60J5/06
- IPC: B60J5/06

Abstract:
A sensor housing which may be used to house a pinch sensor may include: a first portion having a sensor attaching surface and a first connecting member; a second portion that at least partially covers the sensor attaching surface and that has a second connecting member; and, an installation surface that can be used to install the sensor housing onto a vehicle. The second portion may be adjustable with respect to the first portion between: (1) a first condition where the second portion at least partially uncovers the sensor attaching surface and where a sensor can be attached to the sensor attaching surface; and, (2) a second condition where the second portion at least partially covers the sensor and where the second connecting member can be connected to the first connecting member.
Public/Granted literature
- US20110259661A1 SENSOR HOUSING Public/Granted day:2011-10-27
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