Invention Grant
- Patent Title: Fluid distribution apparatus and method facilitating cooling of electronics rack(s) and simulating heated airflow exhaust of electronics rack(s)
- Patent Title (中): 流体分配装置和方法促进电子机架的冷却和模拟电子机架的加热气流排气
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Application No.: US12887551Application Date: 2010-09-22
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Publication No.: US08439561B2Publication Date: 2013-05-14
- Inventor: Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
- Applicant: Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Dennis Jung, Esq.; Kevin P. Radigan, Esq.
- Main IPC: F25D23/12
- IPC: F25D23/12 ; G01K1/16 ; G01K1/12
Abstract:
Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.
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