Invention Grant
- Patent Title: Injection molding machine
- Patent Title (中): 注塑机
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Application No.: US13241726Application Date: 2011-09-23
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Publication No.: US08439664B2Publication Date: 2013-05-14
- Inventor: Sang Hak Kim , Han Sub Hwang
- Applicant: Sang Hak Kim , Han Sub Hwang
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR2008-33080 20080410
- Main IPC: B29C45/13
- IPC: B29C45/13 ; B29C45/16 ; B29C45/40
Abstract:
An injection molding machine to prevent a molded piece from being separated from a mold after molds are disassembled from each other includes a first mold, a second mold assembled with the first mold to form a cavity, and a binding device or a pressing device to get a molded piece held in the first mold when the first mold and the second mold are disassembled from each other.
Public/Granted literature
- US20120013044A1 INJECTION MOLDING MACHINE Public/Granted day:2012-01-19
Information query
