Invention Grant
- Patent Title: High density jack
- Patent Title (中): 高密度千斤顶
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Application No.: US12889996Application Date: 2010-09-24
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Publication No.: US08439702B2Publication Date: 2013-05-14
- Inventor: William H. Dietz , Kenneth A. Cupples , Richard W. Schlueter
- Applicant: William H. Dietz , Kenneth A. Cupples , Richard W. Schlueter
- Applicant Address: US CT New London
- Assignee: Ortronics, Inc.
- Current Assignee: Ortronics, Inc.
- Current Assignee Address: US CT New London
- Agency: McCarter & English, LLP
- Main IPC: H01R13/73
- IPC: H01R13/73

Abstract:
The present disclosure provides for electrical connectors or jack assemblies/housings for use in voice/data communication systems. More particularly, the present disclosure provides for modular jack assemblies that include a movable locking member. The present disclosure provides for improved systems/designs for jack assemblies/housings that are easily secured and/or unsecured to or from a jack panel or jack faceplate. In exemplary embodiments, the present disclosure provides for convenient, low-cost and effective systems and methods for easily securing and/or unsecuring jack assemblies/housings to or from a jack panel/faceplate (e.g., in the field) by utilizing advantageous modular jack assemblies that include a movable locking member, and related assemblies.
Public/Granted literature
- US20120077375A1 High Density Jack Public/Granted day:2012-03-29
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