Invention Grant
- Patent Title: Chemical mechanical polisher with heater and method
- Patent Title (中): 带加热器的化学机械抛光机和方法
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Application No.: US12189641Application Date: 2008-08-11
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Publication No.: US08439723B2Publication Date: 2013-05-14
- Inventor: Robert A. Marks , Christopher Heung-Gyun Lee , Garlen C. Leung , Gregory E. Menk , Jie Diao , Erik S. Rondum
- Applicant: Robert A. Marks , Christopher Heung-Gyun Lee , Garlen C. Leung , Gregory E. Menk , Jie Diao , Erik S. Rondum
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Janah & Associates, P.C.
- Agent Ashok K. Janah
- Main IPC: B24B49/14
- IPC: B24B49/14
Abstract:
A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.
Public/Granted literature
- US20100035515A1 CHEMICAL MECHANICAL POLISHER WITH HEATER AND METHOD Public/Granted day:2010-02-11
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