Invention Grant
US08440044B2 Forming method for polymeric laminated wafers comprising different film materials
有权
包含不同膜材料的聚合物层压晶片的成型方法
- Patent Title: Forming method for polymeric laminated wafers comprising different film materials
- Patent Title (中): 包含不同膜材料的聚合物层压晶片的成型方法
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Application No.: US13192399Application Date: 2011-07-27
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Publication No.: US08440044B2Publication Date: 2013-05-14
- Inventor: Hideyo Sugimura
- Applicant: Hideyo Sugimura
- Applicant Address: US MN Ramsey
- Assignee: Insight Equity A.P.X., L.P.
- Current Assignee: Insight Equity A.P.X., L.P.
- Current Assignee Address: US MN Ramsey
- Agency: Inskeep IP Group, Inc.
- Main IPC: B29D11/00
- IPC: B29D11/00
Abstract:
A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials.
Public/Granted literature
- US20120113523A1 Forming Method For Polymeric Laminated Wafers Comprising Different Film Materials Public/Granted day:2012-05-10
Information query
