Invention Grant
- Patent Title: High-dielectric material
- Patent Title (中): 高介电材料
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Application No.: US12594569Application Date: 2008-04-04
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Publication No.: US08440121B2Publication Date: 2013-05-14
- Inventor: Michael Dunleavy , Sajad Haq , Joseph Maurice Davies , Jason Karl Rew
- Applicant: Michael Dunleavy , Sajad Haq , Joseph Maurice Davies , Jason Karl Rew
- Applicant Address: GB Stevenage, Hertfordshire
- Assignee: MBDA UK Limited
- Current Assignee: MBDA UK Limited
- Current Assignee Address: GB Stevenage, Hertfordshire
- Agency: Faegre Baker Daniels LLP
- Priority: GB0706638.4 20070404
- International Application: PCT/GB2008/001185 WO 20080404
- International Announcement: WO2008/122775 WO 20081016
- Main IPC: C04B35/00
- IPC: C04B35/00

Abstract:
A bulk dielectric material can include a solid composite material having a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material can have, at a frequency of greater than 1 MHz, (i) a permittivity with a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and can have a minimum dimension greater than 2 mm.
Public/Granted literature
- US20100104839A1 HIGH-DIELECTRIC MATERIAL Public/Granted day:2010-04-29
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