Invention Grant
US08440376B2 Exposure determining method, method of manufacturing semiconductor device, and computer program product
有权
曝光确定方法，制造半导体器件的方法和计算机程序产品
- Patent Title: Exposure determining method, method of manufacturing semiconductor device, and computer program product
- Patent Title (中): 曝光确定方法，制造半导体器件的方法和计算机程序产品
-
Application No.: US13007238Application Date: 2011-01-14
-
Publication No.: US08440376B2Publication Date: 2013-05-14
- Inventor: Toshiya Kotani , Kazuya Fukuhara , Michiya Takimoto , Hidefumi Mukai , Soichi Inoue
- Applicant: Toshiya Kotani , Kazuya Fukuhara , Michiya Takimoto , Hidefumi Mukai , Soichi Inoue
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2010-007507 20100115
- Main IPC: G03F9/00
- IPC: G03F9/00 ; G03C5/00
Abstract:
According to one embodiment, a deviation amount distribution of a two-dimensional shape parameter between a mask pattern formed on a mask and a desired mask pattern is acquired as a mask pattern map. Such that a deviation amount of the two-dimensional shape parameter between a pattern on substrate formed when the mask is subjected to exposure shot to form a pattern on a substrate and a desired pattern on substrate fits within a predetermined range, an exposure is determined for each position in the exposure shot in forming the pattern on substrate based on the mask pattern map.
Public/Granted literature
- US20110177458A1 EXPOSURE DETERMINING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND COMPUTER PROGRAM PRODUCT Public/Granted day:2011-07-21
Information query
