A chip quality determination method includes the steps of (a) determining the continuity of defective chips in at least four directions of an X-axis and a Y-axis on a wafer based on the wafer test result of determining the acceptability of chips arranged in a matrix in the four directions on the wafer, and dividing the defective chips into one or more defective groups so that successive ones of the defective chips are in the same defective group; (b) calculating a quality determination index of each of one or more determination target wafer periphery neighboring chips among wafer periphery neighboring chips located within a predetermined range from the periphery of the wafer based on the distance from a corresponding one of the defective groups; and (c) determining the quality of the determination target wafer periphery neighboring chips by comparing the quality determination indexes thereof with a preset threshold.