Invention Grant
- Patent Title: Method for producing zinc oxide-based semiconductor light-emitting device and zinc oxide-based semiconductor light-emitting device
- Patent Title (中): 氧化锌类半导体发光元件及氧化锌类半导体发光元件的制造方法
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Application No.: US12882430Application Date: 2010-09-15
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Publication No.: US08440476B2Publication Date: 2013-05-14
- Inventor: Chizu Kyotani , Naochika Horio
- Applicant: Chizu Kyotani , Naochika Horio
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, P.C.
- Priority: JP2009-213292 20090915
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The ohmic contact between a growth substrate and an electrode formed thereon is improved in a zinc oxide-based semiconductor light-emitting device, thereby improving the light-emission efficiency and reliability A step for forming an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in sequence on a first principal face of a substrate having a composition of MgxZn1-xO (0≦x≦0.68); a step for forming microcracks in a second principal face of the substrate so as to extend toward an interior of the substrate; a step for carrying out a heat treatment at a temperature of 100° C. or higher; and a step for forming an electrode by depositing a metal material composed of one among Al, a Ga alloy, and an In alloy on the second principal face of the substrate, and forming an electrode in a heat treatment at a temperature of 300° C. to 1000° C. are provided.
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