Invention Grant
- Patent Title: Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
- Patent Title (中): 发光器件，封装，发光器件制造方法，封装制造方法和封装制造模具
-
Application No.: US13488560Application Date: 2012-06-05
-
Publication No.: US08440478B2Publication Date: 2013-05-14
- Inventor: Masaki Hayashi
- Applicant: Masaki Hayashi
- Applicant Address: JP Tokushima
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Tokushima
- Agency: Squire Sanders (US) LLP
- Priority: JP2006-356629 20061228
- Main IPC: H01L33/52
- IPC: H01L33/52 ; H01L23/495 ; B29C45/00 ; B29C45/14
Abstract:
A light emitting device includes a resin molded body having a circular or an oval recessed section at the center suppresses generation of cracks. The device is provided with a light emitting element, a first resin molded body having a plurality of outer surfaces, and a recessed section at the center. First and second leads are electrically connected to the light emitting element, and a second resin molded body is applied in the recessed section. The light emitting element is placed on the first lead, and the surface of the second resin molded resin forms a light emitting surface. A gate notch is formed on an extended line of a normal line on one point on a circular cross-section of the recessed section in the normal line direction.
Public/Granted literature
Information query
IPC分类:
