Invention Grant
- Patent Title: Semiconductor device and fabrication method thereof
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Application No.: US13531149Application Date: 2012-06-22
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Publication No.: US08440484B2Publication Date: 2013-05-14
- Inventor: Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yoshihiro Kusuyama
- Applicant: Shunpei Yamazaki , Hideomi Suzawa , Koji Ono , Yoshihiro Kusuyama
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2001-091275 20010327
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
For forming a gate electrode, a conductive film with low resistance including Al or a material containing Al as its main component and a conductive film with low contact resistance for preventing diffusion of Al into a semiconductor layer are laminated, and the gate electrode is fabricated by using an apparatus which is capable of performing etching treatment at high speed.
Public/Granted literature
- US20120264245A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2012-10-18
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