Invention Grant
- Patent Title: Semiconductor component and production method
- Patent Title (中): 半导体元件及生产方法
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Application No.: US13461202Application Date: 2012-05-01
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Publication No.: US08440733B2Publication Date: 2013-05-14
- Inventor: Joachim Mahler , Alfred Haimerl , Michael Bauer , Angela Kessler , Wolfgang Schober
- Applicant: Joachim Mahler , Alfred Haimerl , Michael Bauer , Angela Kessler , Wolfgang Schober
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: C08J9/00
- IPC: C08J9/00
Abstract:
Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam.
Public/Granted literature
- US20120223424A1 SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD Public/Granted day:2012-09-06
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