Curable, one-package, stable adhesive compositions are provided comprising: (a) a resin component comprising a polyepoxide, (b) a polyamine having at least two primary amine, secondary amine, and/or ketimine functional groups; and (c) a curing component comprising dicyandiamide and an accelerator. At least a portion of the polyepoxide in the resin component is reacted with carboxy-terminated butadiene acrylonitrile polymer. The accelerator comprises a reaction product comprising a renewable polyol, a diisocyanate, and a dialkyl monoamine containing alkyl groups with at least two carbon atoms each. The compositions are suitable for use as adhesive compositions over a wide temperature range.