Disclosed is an organosiloxane composition which can be produced at low cost and is usable for bonding of glasses, metals and resins. The organosiloxane composition can provide a cured product exhibiting excellent heat resistance and cold resistance, while having high strength and high transparency. Specifically disclosed is a polyorganosiloxane composition containing (A) a polyorganosiloxane wherein at least one end of each molecule is modified with a silanol group, and (B) 0.5-4.0 moles of a metal alkoxide per 1 mole of the polyorganosiloxane, wherein the mean molecular weight (Mw) of the polyorganosiloxane according to the mass fraction is not more than 1,000. Also specifically disclosed are a cured product of the composition and a method for producing the composition.