Invention Grant
- Patent Title: Method and structure for forming module using a powder coating and thermal treatment process
- Patent Title (中): 使用粉末涂层和热处理工艺形成模块的方法和结构
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Application No.: US12372722Application Date: 2009-02-17
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Publication No.: US08440903B1Publication Date: 2013-05-14
- Inventor: Chester A. Farris, III
- Applicant: Chester A. Farris, III
- Applicant Address: US CA San Jose
- Assignee: Stion Corporation
- Current Assignee: Stion Corporation
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H02N6/00
- IPC: H02N6/00 ; H01L31/042 ; H01L21/00

Abstract:
The present invention provides a solar module formed using a powder coating and thermal treatment process. The solar module includes a substrate having a surface region and a photovoltaic material overlying the surface region. The solar module further includes a barrier material overlying the photovoltaic material. Moreover, the solar module includes a coating overlying the barrier material and enclosing the photovoltaic material to mechanically protect the photovoltaic material. In certain embodiments, photovoltaic material is a thin film photovoltaic cell and the coating is provided by a powder coating substantially free of bubbles formed by electrostatic spraying and cured with a thermal treatment process.
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