Invention Grant
- Patent Title: Assembly of case and electronic components and combination of the assembly and external connectors
- Patent Title (中): 外壳和电子组件的组装以及组装和外部连接器的组合
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Application No.: US13025583Application Date: 2011-02-11
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Publication No.: US08440918B2Publication Date: 2013-05-14
- Inventor: Kazurou Matsumoto , Akira Nakasaka
- Applicant: Kazurou Matsumoto , Akira Nakasaka
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2010-028625 20100212; JP2011-003138 20110111
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
An assembly includes at least one electronic component, a bus bar electrically connected to the electronic component and having a connection portion, a case receiving both the electronic component and the bus bar and having first and second openings, and a drop prevention member having a drop prevention wall. The connection portion of the bus bar is to be connected with a terminal of an external connector by engaging a first engaging member to be placed inside the case through the first opening and a second engaging member provided in the external connector. In the assembly, there is defined, by the drop prevention wall, the connection portion of the bus bar, and part of the external connector, a confinement space for confining the first engaging member and thereby preventing it from dropping outside the confinement space during establishment of the engagement between the first and second engaging members.
Public/Granted literature
- US20110198121A1 ASSEMBLY OF CASE AND ELECTRONIC COMPONENTS AND COMBINATION OF THE ASSEMBLY AND EXTERNAL CONNECTORS Public/Granted day:2011-08-18
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