Invention Grant
- Patent Title: Heating resistor element component and method of manufacturing heating resistor element component
- Patent Title (中): 加热电阻元件组件和制造加热电阻元件组件的方法
-
Application No.: US12589594Application Date: 2009-10-26
-
Publication No.: US08440943B2Publication Date: 2013-05-14
- Inventor: Norimitsu Sanbongi , Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Yoshinori Sato
- Applicant: Norimitsu Sanbongi , Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Yoshinori Sato
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2008-276055 20081027
- Main IPC: H05B3/02
- IPC: H05B3/02

Abstract:
A heating resistor element component has a substrate and an adhesive layer provided on the substrate and including an adhesive and gap members arranged substantially uniformly in the adhesive. A heat storage layer is laminated on the substrate through intermediation of the adhesive layer so that the gap members maintain a distance between surfaces of the substrate and the heat storage layer constant. At least one heating resistor formed on the heat storage layer has a heating portion that generates heat. A cavity is provided in a region of the adhesive layer and interposed between the surfaces of the substrate and the heat storage layer. The cavity functions as a heat insulating layer for regulating an inflow of heat from the heat storage layer to the substrate.
Public/Granted literature
- US20100122979A1 Heating resistor element component Public/Granted day:2010-05-20
Information query