Invention Grant
- Patent Title: Light emitting device, method of manufacturing the same, light emitting device package and lighting system
- Patent Title (中): 发光装置及其制造方法,发光装置封装及照明系统
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Application No.: US13071659Application Date: 2011-03-25
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Publication No.: US08440995B2Publication Date: 2013-05-14
- Inventor: Sung Min Hwang
- Applicant: Sung Min Hwang
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2010-0027488 20100326
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L29/06 ; H01L31/00

Abstract:
A light emitting device is provided that includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, a superlattice structure layer on the second conductive semiconductor layer, and a third conductive semiconductor layer on the superlattice structure layer; a light transmission electrode layer on the light emitting structure; a first electrode connected to the first conductive semiconductor layer; a second electrode electrically connected to the light transmission electrode layer on the light emitting structure; and an insulating layer that extends from a lower portion of the second electrode to an upper portion of the second conductive semiconductor layer.
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