Invention Grant
US08440995B2 Light emitting device, method of manufacturing the same, light emitting device package and lighting system 有权
发光装置及其制造方法,发光装置封装及照明系统

Light emitting device, method of manufacturing the same, light emitting device package and lighting system
Abstract:
A light emitting device is provided that includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, a superlattice structure layer on the second conductive semiconductor layer, and a third conductive semiconductor layer on the superlattice structure layer; a light transmission electrode layer on the light emitting structure; a first electrode connected to the first conductive semiconductor layer; a second electrode electrically connected to the light transmission electrode layer on the light emitting structure; and an insulating layer that extends from a lower portion of the second electrode to an upper portion of the second conductive semiconductor layer.
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