Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12974254Application Date: 2010-12-21
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Publication No.: US08441009B2Publication Date: 2013-05-14
- Inventor: Yoshinori Ieda
- Applicant: Yoshinori Ieda
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-295335 20091225
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L29/788 ; H01L21/336

Abstract:
In a semiconductor device using a nonvolatile memory, high speed erasing operation and low power consumption are realized. In a nonvolatile memory in which a channel formation region, a tunnel insulating film, and a floating gate are stacked in this order, the channel formation region is formed using an oxide semiconductor layer. In addition, a metal wiring for erasing is provided in a lower side of the channel formation region so as to face the floating gate. With the above structure, when erasing operation is performed, charge accumulated in the floating gate is extracted to the metal wiring through the channel formation region. Consequently, high speed erasing operation and low power consumption of the semiconductor device can be realized.
Public/Granted literature
- US20110156023A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-06-30
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