Invention Grant
- Patent Title: Light emitting device including a lighting emitting chip attached on a heat conductive layer via an undercoating and method of manufacturing the light emitting device
- Patent Title (中): 发光装置，其包括通过底涂层附着在导热层上的发光芯片和制造发光器件的方法
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Application No.: US13488094Application Date: 2012-06-04
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Publication No.: US08441028B2Publication Date: 2013-05-14
- Inventor: Kimberly Peiler
- Applicant: Kimberly Peiler
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cozen O'Connor
- Main IPC: H01L33/58
- IPC: H01L33/58
Abstract:
A light emitting device comprising a heat sink, a dielectric layer arranged on the heat sink, a heat conductive layer arranged on the dielectric layer, an undercoating arranged on at least a part of the heat conductive layer, and a light emitting chip attached to the heat conductive layer by means of the undercoating.
Public/Granted literature
- US20120235202A1 Light Emitting Device and Method of Manufacturing a Light Emitting Device Public/Granted day:2012-09-20
Information query
IPC分类:
