Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11724389Application Date: 2007-03-15
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Publication No.: US08441036B2Publication Date: 2013-05-14
- Inventor: Yoshio Shimoida , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami , Masakatsu Hoshi
- Applicant: Yoshio Shimoida , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami , Masakatsu Hoshi
- Applicant Address: JP Yokohama-shi, Kanagawa
- Assignee: Nissan Motor Co., Ltd.
- Current Assignee: Nissan Motor Co., Ltd.
- Current Assignee Address: JP Yokohama-shi, Kanagawa
- Agency: Young Basile
- Priority: JP2006-079107 20060322
- Main IPC: H01L29/739
- IPC: H01L29/739

Abstract:
A trench is formed extending from a surface of a hetero semiconductor region of a polycrystal silicon to the drain region. Further, a driving point of the field effect transistor, where a gate insulating film, the hetero semiconductor region and the drain region are adjoined, is formed at a position spaced apart from a side wall of the trench.
Public/Granted literature
- US20070221955A1 Semiconductor device and method of manufacturing the same Public/Granted day:2007-09-27
Information query
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