Invention Grant
- Patent Title: Semiconductor device having a thin film stacked structure
- Patent Title (中): 具有薄膜堆叠结构的半导体器件
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Application No.: US13262292Application Date: 2010-03-31
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Publication No.: US08441037B2Publication Date: 2013-05-14
- Inventor: Hirotaka Geka
- Applicant: Hirotaka Geka
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Microdevices Corporation
- Current Assignee: Asahi Kasei Microdevices Corporation
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2009-237661 20091014
- International Application: PCT/JP2010/002371 WO 20100331
- International Announcement: WO2010/113501 WO 20101007
- Main IPC: H01L31/06
- IPC: H01L31/06 ; H01L29/66

Abstract:
An objective is to provide a semiconductor device capable of utilizing properties of a high-mobility electron transport layer with a thin film stacked structure having large ΔEc, high electron mobility, and simplified element fabrication process even when the substrate material and the electron transport layer greatly differ in lattice constant. The semiconductor device includes: a semiconductor substrate (1); a first barrier layer (2) on the substrate (1); an electron transport layer (3) on the first barrier layer (2); and a second barrier layer (4) on the electron transport layer (3). The first barrier layer (2) has an InxAl1-xAs layer. At least one of the first barrier layer (2) and the second barrier layer (4) has a stacked structure having an AlyGa1-yAszSb1-z layer in contact with the electron transport layer (3) and an InxAl1-xAs layer in contact with the AlyGa1-yAszSb1-z layer. The stacked structure is doped with a donor impurity.
Public/Granted literature
- US20120018782A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-01-26
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