Invention Grant
US08441053B2 Vertical capacitor-less DRAM cell, DRAM array and operation of the same
有权
垂直无电容的DRAM单元,DRAM阵列和操作相同
- Patent Title: Vertical capacitor-less DRAM cell, DRAM array and operation of the same
- Patent Title (中): 垂直无电容的DRAM单元,DRAM阵列和操作相同
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Application No.: US12905100Application Date: 2010-10-15
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Publication No.: US08441053B2Publication Date: 2013-05-14
- Inventor: Hui-Huang Chen , Chih-Yuan Chen , Chun-Cheng Chen , Ching-Ching Tsai , Ting-Jyun He , Tai-Liang Hsiung
- Applicant: Hui-Huang Chen , Chih-Yuan Chen , Chun-Cheng Chen , Ching-Ching Tsai , Ting-Jyun He , Tai-Liang Hsiung
- Applicant Address: TW Hsinchu
- Assignee: Powerchip Technology Corporation
- Current Assignee: Powerchip Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94 ; H01L21/70 ; G11C11/34 ; G11C7/00

Abstract:
A vertical capacitor-less DRAM cell is described, including: a source layer having a first conductivity type, a storage layer disposed on the source layer and having a second conductivity type, an active layer disposed on the storage layer and having the first conductivity type, a drain layer disposed on the active layer and having the second conductivity type, an address gate disposed beside the active layer and separated from the same by a first gate dielectric layer, and a storage gate disposed beside the storage layer and separated from the same by a second gate dielectric layer. The DRAM cell can be written by turning on the MOSFET formed by the storage layer, the active layer, the drain layer, the first gate dielectric layer and the address gate to inject carriers into the storage layer from the active layer.
Public/Granted literature
- US20120092925A1 VERTICAL CAPACITOR-LESS DRAM CELL, DRAM ARRAY AND OPERATION OF THE SAME Public/Granted day:2012-04-19
Information query
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