Invention Grant
- Patent Title: Elimination of RDL using tape base flip chip on flex for die stacking
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Application No.: US13407003Application Date: 2012-02-28
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Publication No.: US08441113B2Publication Date: 2013-05-14
- Inventor: Teck Kheng Lee
- Applicant: Teck Kheng Lee
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Priority: SG200200130-3 20020109
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are provided. The incorporation of the flexible film interposer achieves densely packaged semiconductor devices, without the need for a redistribution layer (RDL).
Public/Granted literature
- US20120153468A1 Elimination of RDL Using Tape Base Flip Chip on Flex for Die Stacking Public/Granted day:2012-06-21
Information query
IPC分类:
